Tags and Chips


One of the key advantages of Magellan PJM RFID systems is the ability to identify tags on items when multiple items are stacked, or closely located, even in the presence of liquids.  This stacking feature is provided by PJM StackTags®.  Magellan provides a number of tag formats and tag sizes to suit different applications.

Magellan also provides dedicated PJM RFID chips for customers who wish to build their own tags.  Chips are supplied on wafers.  

  

Features

      
   
  • Operation frequency 13.56 MHz
  • Identification speeds up to 1200 tags/second (not including reader overhead)
  • Command data rate of 424 kbit/s
  • Reply data rate of 106 kbit/s per reply channel - Reply data rate of 424 kbit/s can be used for single tag operation
  • Reply frequency hopping over 8 randomly  selected channels
  • Rewritable EEPROM, up to 8kbit of user memory
  • Unique serial number
  • Permanent write locking of user memory
  • Optional 48 bit password protection
  • State retention during temporary power loss
  • Minimal tag to tag stacking separation for large stacks
  • ESD protection 2kV
  • EEPROM data retention greater than 10 years
  • EEPROM endurance greater than 100,000 erase/write cycles
  • Fast EEPROM programming
 

 

Tags

The Tag Information Chart details a number of popular tag types available from Magellan.  Depending on volumes, new tags can be designed for particular applications.  Typically, tags are provided as bare inlets, transparent adhesive labels or paper adhesive labels. 

The tags are suitable for various applications including: Health Care Management, Pharmaceuticals, Document Management, Factory Automation, Production Control, Supply Chain Management, Electronic Tickets, Access Control, Loyalty Cards and Object Identification.

 

  **Note: At manufacture the ST chip Configuration Word (word 6 in memory) is typically set to 6000hex for ease of manufacture and tag issuing/personalisation.  When ST chips are used in stacking applications the user must configure the chip by writing to the Configuration Word and changing its contents to 3000hex.  For ease of chip configuration the user can configure the chips to 3000hex for all stacking or non-stacking applications. 

Chips

The chip communications with readers is compliant with the International Standard ISO/IEC 18000-3 MODE2 item management air interface.  This standard has been optimised for high speed identification of large tag populations.

All chip types can be supplied on 8 inch wafers.  NiAU bumped die wafers are sawn and un-bumped die are supplied on sawn or un-sawn wafers.

 

Related items

 


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